Tampilkan postingan dengan label PLATFORMS. Tampilkan semua postingan
Tampilkan postingan dengan label PLATFORMS. Tampilkan semua postingan

Selasa, 28 Agustus 2012

AMD RELEASES ITS TIGRIS AND CONGO MOBILE PLATFORMS FOR NOTEBOOKS


AMD’s newest mobile platforms for notebooks – the Tigris and the Congo - have been released. The chipmaker claims that the new platforms will improve the multimedia performance while at the same time extending battery life.

Tigris is aimed at the mainstream notebook market. It supports the DirectX 10.1 standard and is capable of decoding full 1080p HD video. AMD claims that it will also extend the battery life by up to 25%. Other power saving innovations on processors based on this platform include me buffer compression, PSI support and dynamic backlight reduction. The Tigris platform will feature the 45nm dual core Caspian CPUs and the Radeon HD 4200 GPU.

The Congo platform is also capable of full 1080p HD video playback and supports the Direct 10.1 standard. This platform will offer a slightly longer battery life by running dual core Neo CPUs and Radeon HD 3200 GPU.

Rabu, 11 Januari 2012

VIA TECHNOLOGIES – LAUNCHING THE NEW POWER EFFICIENT PROCESSOR PLATFORMS

VIA Technologies, Inc, a principal leading light of power proficient x86 processor platforms today revealed the new-fangled VIA Open-Book, mini-note allusion design embattled at the swiftly growing global marketplace for ultra-portable laptops.
The VIA Open-Book mini-note orientation intend introduces a swarm of novel innovations, together with the next age band of VIA Ultra Mobile Platform, based on the VIA C7®-M ULV processor and the innovative all-in-one VIA VX800 digital media IGP chipset. Mutually, this ultra packed together, power proficient platform provides the user with more affluent computing and multimedia skin texture, inclusive of a startling 8.9” screen and superior video playback shore up, in a compacted and fashionable clamshell outward appearance feature that weighs at just a mere 1kg.

The VIA Open-Book serves a supple in-house crossing point for high-speed broadband wireless connectivity that serves customers with the aptitude to decide on from an array of option provided like Wi-MAX, HSDPA and EV-DO/W-CDMA modules suitable to their market. In adding together, under a only one of its kind mutual approach, the CAD files of the peripheral panels of the orientation design are presented for download under a Creative Commons ascription Share Alike 3.0 license to serve the likes of customers such as OEMs, system integrators, and broadband service providers with superior freedom in tailoring the glance and feel of their piece of equipment to convene the varied needs of their intended markets.