VIA TECHNOLOGIES – LAUNCHING THE NEW POWER EFFICIENT PROCESSOR PLATFORMS

VIA Technologies, Inc, a principal leading light of power proficient x86 processor platforms today revealed the new-fangled VIA Open-Book, mini-note allusion design embattled at the swiftly growing global marketplace for ultra-portable laptops.
The VIA Open-Book mini-note orientation intend introduces a swarm of novel innovations, together with the next age band of VIA Ultra Mobile Platform, based on the VIA C7®-M ULV processor and the innovative all-in-one VIA VX800 digital media IGP chipset. Mutually, this ultra packed together, power proficient platform provides the user with more affluent computing and multimedia skin texture, inclusive of a startling 8.9” screen and superior video playback shore up, in a compacted and fashionable clamshell outward appearance feature that weighs at just a mere 1kg.

The VIA Open-Book serves a supple in-house crossing point for high-speed broadband wireless connectivity that serves customers with the aptitude to decide on from an array of option provided like Wi-MAX, HSDPA and EV-DO/W-CDMA modules suitable to their market. In adding together, under a only one of its kind mutual approach, the CAD files of the peripheral panels of the orientation design are presented for download under a Creative Commons ascription Share Alike 3.0 license to serve the likes of customers such as OEMs, system integrators, and broadband service providers with superior freedom in tailoring the glance and feel of their piece of equipment to convene the varied needs of their intended markets.